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      (LASER peeling equipment, laser irradiation equipment)

      This LASER debonding equipment is used for a semiconductor packaging process or manufacturing process for ultra-thin semiconductors to peel off a temporary bonding layer with a LASER beam without stress.
      Using a pulse LASER with a LASER beam wavelength of 355 nm licensed from IBM, this equipment ensures that the LASER beam is absorbed only on the surface of a temporary resin layer, thus curtailing damage to the device.
      It supports FOPLP of large panel size, achieving uniform LASER irradiation for workpieces of up to 600 mm2.

      Series Name

      • SELD-LASER Series

      Applications

      • A temporary bonding process for forming semiconductor packaging
      • A temporary bonding process for forming a semiconductor re-distribution layer (RDL)
      • A temporary bonding process for forming an ultra-thin semiconductor
      • Other processes using temporary bonding
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      For Inquiries About This Product
      • Company:
        Shin-Etsu Engineering Co., LTD.
      • Department:
        Electro-Mechanics Division
      • Email:
        systeminfo@see.jp
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